"Memory die" refers to a small block of semiconducting material on which a given functional circuit is fabricated. Typically, integrated circuits are produced in large batches on a single wafer of electronic-grade silicon (EGS) or other semiconductor (such as GaAs) through processes such as photolithography. The wafer is cut (diced) into many pieces, each containing one copy of the circuit. Each of these pieces is called a die. (Search 'die (integrated circuit)' on Wikipedia.com Oct. 9, 2019. Accessed Nov. 18, 2019.) A memory die is a die, in one embodiment, that includes a functional circuit for operating as a non-volatile memory media and/or a non-volatile memory array. … more "Memory die" refers to a small block of semiconducting material on which a given functional circuit is fabricated. Typically, integrated circuits are produced in large batches on a single wafer of electronic-grade silicon (EGS) or other semiconductor (such as GaAs) through processes such as photolithography. The wafer is cut (diced) into many pieces, each containing one copy of the circuit. Each of these pieces is called a die. (Search 'die (integrated circuit)' on Wikipedia.com Oct. 9, 2019. Accessed Nov. 18, 2019.) A memory die is a die, in one embodiment, that includes a functional circuit for operating as a non-volatile memory media and/or a non-volatile memory array.

"Storage controller" refers to any hardware, device, component, element, or circuit configured to manage data operations on non-volatile memory media, and may comprise one or more processors, programmable processors (e.g., FPGAs), ASICs, micro-controllers, or the like. In some embodiments, the storage controller is configured to store data on and/or read data from non-volatile memory media, to transfer data to/from the non-volatile memory device(s), and so on. … more "Storage controller" refers to any hardware, device, component, element, or circuit configured to manage data operations on non-volatile memory media, and may comprise one or more processors, programmable processors (e.g., FPGAs), ASICs, micro-controllers, or the like. In some embodiments, the storage controller is configured to store data on and/or read data from non-volatile memory media, to transfer data to/from the non-volatile memory device(s), and so on.

"Upper ground plane" refers to a ground plane positioned in a multilayer printed circuit board above another ground plane. In certain embodiments, the upper ground plane may be atop most ground plane. … more "Upper ground plane" refers to a ground plane positioned in a multilayer printed circuit board above another ground plane. In certain embodiments, the upper ground plane may be atop most ground plane.

"Ground trace" refers to structure configured to conduct an electronic signal to a ground source (also referred to simply as ‘ground’). A ground trace may include one or more structures or electrical components along the length of the ground trace. In certain embodiments, such structures or electrical components may be a part of the ground trace. … more "Ground trace" refers to structure configured to conduct an electronic signal to a ground source (also referred to simply as ‘ground’). A ground trace may include one or more structures or electrical components along the length of the ground trace. In certain embodiments, such structures or electrical components may be a part of the ground trace.

"Wire bond" refers to a wire, often made of aluminum, alloyed aluminum, copper, silver, gold or doped gold, for interconnection of integrated circuits, communication buses and/or communication channels. … more "Wire bond" refers to a wire, often made of aluminum, alloyed aluminum, copper, silver, gold or doped gold, for interconnection of integrated circuits, communication buses and/or communication channels.

"Impedance" refers to a measure of the opposition that a circuit presents to a current when a voltage is applied.Quantitatively, the impedance of a two-terminal circuit element is the ratio of the complex representation of the sinusoidal voltage between its terminals, to the complex representation of the current flowing through the circuit. In general, impedance depends upon the frequency of the sinusoidal voltage.Impedance extends the concept of resistance to alternating current (AC) circuits, and possesses both magnitude and phase, unlike resistance, which has only magnitude. Impedance is a complex number, with the same units as resistance, for which the SI unit is the ohm (Ω). Its symbol is usually Z, and it may be represented by writing its magnitude and phase in the polar form |Z|∠θ. However, cartesian complex number representation is often more powerful for circuit analysis purposes. (Search "impedance" on Wikipedia.com May 31, 2020. Modified. Accessed June 2, 2020.) … more "Impedance" refers to a measure of the opposition that a circuit presents to a current when a voltage is applied.Quantitatively, the impedance of a two-terminal circuit element is the ratio of the complex representation of the sinusoidal voltage between its terminals, to the complex representation of the current flowing through the circuit. In general, impedance depends upon the frequency of the sinusoidal voltage.Impedance extends the concept of resistance to alternating current (AC) circuits, and possesses both magnitude and phase, unlike resistance, which has only magnitude. Impedance is a complex number, with the same units as resistance, for which the SI unit is the ohm (Ω). Its symbol is usually Z, and it may be represented by writing its magnitude and phase in the polar form |Z|∠θ. However, cartesian complex number representation is often more powerful for circuit analysis purposes. (Search "impedance" on Wikipedia.com May 31, 2020. Modified. Accessed June 2, 2020.)

"Lower ground plane" refers to a ground plane positioned in a multilayer printed circuit board below another ground plane. In certain embodiments, the lower ground plane may be the lowest ground plane and/or a final layer that is adjacent to a substrate for the lower ground plane. … more "Lower ground plane" refers to a ground plane positioned in a multilayer printed circuit board below another ground plane. In certain embodiments, the lower ground plane may be the lowest ground plane and/or a final layer that is adjacent to a substrate for the lower ground plane.

"Ground via" refers to a via configured to electrically connect a ground source (also referred to simply as ‘ground’) or a structure conducting an electrical signal to a ground source. … more "Ground via" refers to a via configured to electrically connect a ground source (also referred to simply as ‘ground’) or a structure conducting an electrical signal to a ground source.

"Reflection coefficient" refers to a ratio of the voltage or current of the reflected wave to the voltage or current of the incident wave, or the wave that passes past the point of reflection to continue down a transmission line. … more "Reflection coefficient" refers to a ratio of the voltage or current of the reflected wave to the voltage or current of the incident wave, or the wave that passes past the point of reflection to continue down a transmission line.

"Multilayer printed circuit board" refers to a printed circuit board or “PCB” comprising a plurality of layers of conductive and non-conductive materials. The layers of the multilayer printed circuit board may be configured to provide one or more of mechanical structural support and/or electrically conductive structures such as signal traces. Non-conductive layers of the multilayer printed circuit board may comprise insulation layers. Conductive layers of the multilayer printed circuit board may comprise a patterned metal such as copper, aluminum, or the like. Patterned structures of a conductive layer may be coated and/or encased a non-conductive layer formed on top of the conductive layer.In certain embodiments, a lower most layer of the multilayer printed circuit board may comprise a substrate. The number and type of layers of a multilayer printed circuit board may vary depending on the use case. In certain embodiments, the multilayer printed circuit board comprises 4, 6, 8, 10, 12, or 18 layers. In one embodiment, a multilayer printed circuit board comprises a lower ground plane layer positioned adjacent to the substrate and an upper ground plane layer positioned above one more intermediate layers that are adjacent to the lower ground plane layer. … more "Multilayer printed circuit board" refers to a printed circuit board or “PCB” comprising a plurality of layers of conductive and non-conductive materials. The layers of the multilayer printed circuit board may be configured to provide one or more of mechanical structural support and/or electrically conductive structures such as signal traces. Non-conductive layers of the multilayer printed circuit board may comprise insulation layers. Conductive layers of the multilayer printed circuit board may comprise a patterned metal such as copper, aluminum, or the like. Patterned structures of a conductive layer may be coated and/or encased a non-conductive layer formed on top of the conductive layer.In certain embodiments, a lower most layer of the multilayer printed circuit board may comprise a substrate. The number and type of layers of a multilayer printed circuit board may vary depending on the use case. In certain embodiments, the multilayer printed circuit board comprises 4, 6, 8, 10, 12, or 18 layers. In one embodiment, a multilayer printed circuit board comprises a lower ground plane layer positioned adjacent to the substrate and an upper ground plane layer positioned above one more intermediate layers that are adjacent to the lower ground plane layer.

"Characteristic impedance" refers to a ratio of the amplitudes of voltage and current of a single signal wave propagating along the line; that is, a wave travelling in one direction in the absence of reflections in the other direction. Characteristic impedance (usually written Z0) is typically defined in relation to a uniform transmission line. Alternatively, and equivalently, characteristic impedance can be defined as the input impedance of a transmission line when the transmission line's length is infinite. Characteristic impedance is determined by the geometry and materials of the transmission line and, for a uniform transmission line, is not dependent on the uniform transmission line's length. The SI unit of characteristic impedance is the ohm.The characteristic impedance of a lossless transmission line is purely real, with no reactive component. Energy supplied by a source at one end of such a line is transmitted through the line without being dissipated in the line itself. A transmission line of finite length (lossless or lossy) that is terminated at one end with an impedance equal to the characteristic impedance appears to the source like an infinitely long transmission line and produces no reflections. (Search "characteristic impedance" on Wikipedia.com May 17, 2020. Modified. Accessed June 2, 2020.) … more "Characteristic impedance" refers to a ratio of the amplitudes of voltage and current of a single signal wave propagating along the line; that is, a wave travelling in one direction in the absence of reflections in the other direction. Characteristic impedance (usually written Z0) is typically defined in relation to a uniform transmission line. Alternatively, and equivalently, characteristic impedance can be defined as the input impedance of a transmission line when the transmission line's length is infinite. Characteristic impedance is determined by the geometry and materials of the transmission line and, for a uniform transmission line, is not dependent on the uniform transmission line's length. The SI unit of characteristic impedance is the ohm.The characteristic impedance of a lossless transmission line is purely real, with no reactive component. Energy supplied by a source at one end of such a line is transmitted through the line without being dissipated in the line itself. A transmission line of finite length (lossless or lossy) that is terminated at one end with an impedance equal to the characteristic impedance appears to the source like an infinitely long transmission line and produces no reflections. (Search "characteristic impedance" on Wikipedia.com May 17, 2020. Modified. Accessed June 2, 2020.)

"Source via" refers to a via configured to electrically connect a signal source or a structure conducting a signal source to a signal trace. … more "Source via" refers to a via configured to electrically connect a signal source or a structure conducting a signal source to a signal trace.

"Bonding pad" refers to a conductive structure for connecting a trace and a wire bond or pin for an electrical connection. … more "Bonding pad" refers to a conductive structure for connecting a trace and a wire bond or pin for an electrical connection.

"Ground source" refers to a structure or connection or component that serves as ground or serves to ground an electrical signal. … more "Ground source" refers to a structure or connection or component that serves as ground or serves to ground an electrical signal.

"Signal source" refers to a circuit, sub-circuit, electronic component, hardware, software, firmware, module, logic, device, or apparatus configured, programmed, designed, arranged, or engineered to supply a voltage, current, or electromagnetic wave that varies over time, either in analog or digital wave form, to another structure, circuit, sub-circuit, electronic component, logic, device, or apparatus. … more "Signal source" refers to a circuit, sub-circuit, electronic component, hardware, software, firmware, module, logic, device, or apparatus configured, programmed, designed, arranged, or engineered to supply a voltage, current, or electromagnetic wave that varies over time, either in analog or digital wave form, to another structure, circuit, sub-circuit, electronic component, logic, device, or apparatus.

"Word line to word line short" refers to a type of error condition in which one or more word lines have an electrical short between a structure of the word line and another structure, such as another word line, such that word lines included in the word line to word line short are unusable and data on the word lines has too many errors. … more "Word line to word line short" refers to a type of error condition in which one or more word lines have an electrical short between a structure of the word line and another structure, such as another word line, such that word lines included in the word line to word line short are unusable and data on the word lines has too many errors.

"Plane" or “Memory Plane” refers to a division of the memory array that permits certain storage operations to be performed on both planes using certain physical row addresses and certain physical column addresses. Other storage operations may be performed on a single plane within a memory die. … more "Plane" or “Memory Plane” refers to a division of the memory array that permits certain storage operations to be performed on both planes using certain physical row addresses and certain physical column addresses. Other storage operations may be performed on a single plane within a memory die.

"Merger" refers to any hardware, software, firmware, circuit, component, module, logic, device, or apparatus configured, programmed, designed, arranged, or engineered to generate a destination storage block based on two or more source storage blocks. In one embodiment, the merger may combine, merge, or fold data from source storage blocks into a destination storage block. In another embodiment, the merger may instruct, direct, command, and/or orchestrate the actions of other circuits, components, devices, or systems in order to generate the destination storage block. For example, in a non-volatile storage device, the merger may be implemented in a storage controller and all except the differential data may remain on a non-volatile memory array, and the merger may direct memory die of the non-volatile memory array to combine data from a plurality of source storage blocks to form a destination storage block within the non-volatile memory array. … more "Merger" refers to any hardware, software, firmware, circuit, component, module, logic, device, or apparatus configured, programmed, designed, arranged, or engineered to generate a destination storage block based on two or more source storage blocks. In one embodiment, the merger may combine, merge, or fold data from source storage blocks into a destination storage block. In another embodiment, the merger may instruct, direct, command, and/or orchestrate the actions of other circuits, components, devices, or systems in order to generate the destination storage block. For example, in a non-volatile storage device, the merger may be implemented in a storage controller and all except the differential data may remain on a non-volatile memory array, and the merger may direct memory die of the non-volatile memory array to combine data from a plurality of source storage blocks to form a destination storage block within the non-volatile memory array.

"Page buffer" refers to any circuit, sub-circuit, electronic component, hardware, software, firmware, module, logic, memory, volatile memory, device, or apparatus configured, programmed, designed, arranged, or engineered to temporarily store a data value.In one embodiment, a non-volatile memory array includes one or more page buffers implemented as latches, electronic circuits, that store a data value sensed by sense amplifiers coupled to bit lines of the non-volatile memory array. In certain embodiments, a page buffer may include a latch for each bit line along a row ( a physical page or logical page) such that the memory cells of a physical page or logical page are sensed/read into the page buffer in a single read/sense operation for the memory die.For a non-volatile memory array having memory cells configured to store more than one bit per memory cell, the non-volatile memory array may include a separate page buffer for each bit that the memory cells are storing. (e.g., a QLC non-volatile memory array may include four page buffers). … more "Page buffer" refers to any circuit, sub-circuit, electronic component, hardware, software, firmware, module, logic, memory, volatile memory, device, or apparatus configured, programmed, designed, arranged, or engineered to temporarily store a data value.In one embodiment, a non-volatile memory array includes one or more page buffers implemented as latches, electronic circuits, that store a data value sensed by sense amplifiers coupled to bit lines of the non-volatile memory array. In certain embodiments, a page buffer may include a latch for each bit line along a row ( a physical page or logical page) such that the memory cells of a physical page or logical page are sensed/read into the page buffer in a single read/sense operation for the memory die.For a non-volatile memory array having memory cells configured to store more than one bit per memory cell, the non-volatile memory array may include a separate page buffer for each bit that the memory cells are storing. (e.g., a QLC non-volatile memory array may include four page buffers).

XOR buffer memory" refers to a buffer memory used to temporarily store XOR parity data. … more XOR buffer memory" refers to a buffer memory used to temporarily store XOR parity data.