Term #1,336
multilayer printed circuit board
Claim Term
multilayer printed circuit board
Origin matter
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Reference Case 1
FSP1843
Date Added
7/16/20
Created
7/16/20, 2:35 PM
Modified
7/16/20, 2:35 PM
Full Desc
"Multilayer printed circuit board" refers to a printed circuit board or “PCB” comprising a plurality of layers of conductive and non-conductive materials. The layers of the multilayer printed circuit board may be configured to provide one or more of mechanical structural support and/or electrically conductive structures such as signal traces. Non-conductive layers of the multilayer printed circuit board may comprise insulation layers. Conductive layers of the multilayer printed circuit board may comprise a patterned metal such as copper, aluminum, or the like. Patterned structures of a conductive layer may be coated and/or encased a non-conductive layer formed on top of the conductive layer.In certain embodiments, a lower most layer of the multilayer printed circuit board may comprise a substrate. The number and type of layers of a multilayer printed circuit board may vary depending on the use case. In certain embodiments, the multilayer printed circuit board comprises 4, 6, 8, 10, 12, or 18 layers. In one embodiment, a multilayer printed circuit board comprises a lower ground plane layer positioned adjacent to the substrate and an upper ground plane layer positioned above one more intermediate layers that are adjacent to the lower ground plane layer.