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Id Matter Term Definition Doc No Modified Actions
953 thin film deposition
"Thin film deposition" refers to any technique for depositing a thin film of material onto a substrate or onto previously deposited layers. (Search "thin film" on Wikipedia.com April 1, 2020. Accessed April 3, 2020.) Examples of different types of thin film deposition include, but are not limited to, chemical deposition, physical deposition, epitaxy, and the like. Examples of chemical deposition include chemical solution deposition (CSD) or chemical bath deposition (CBD), spin coating or spin casting, dip coating, chemical vapor deposition (CVD), plasma enhanced CVD (PECVD), atomic layer deposition (ALD), molecular vapor deposition (MLD), and the like. Examples of physical deposition include a thermal evaporator, molecular beam epitaxy (MBE), an electron beam evaporator, sputtering, pulsed laser deposition, cathodic arc deposition, electrohydrodynamic deposition, and the like. Embodiments claimed and described herein may use one or more current or future thin film deposition techniques to implement one or more of the process steps disclosed. "Thin film deposition" refers to any technique for depositing a thin film of material onto a substrate or onto previously deposited layers. (Search "thin film" on Wikipedia.com April 1, 2020. Accessed April 3, 2020.) Examples of different types of thin film deposition include, but are not limited to, chemical deposition, physical deposition, epitaxy, and the like. Examples of chemical deposition include chemical solution deposition (CSD) or chemical bath deposition (CBD), spin coating or spin casting, dip coating, chemical vapor deposition (CVD), plasma enhanced CVD (PECVD), atomic layer deposition (ALD), molecular vapor deposition (MLD), and the like. Examples of physical deposition include a thermal evaporator, molecular beam epitaxy (MBE), an electron beam evaporator, sputtering, pulsed laser deposition, cathodic arc deposition, electrohydrodynamic deposition, and the like. Embodiments claimed and described herein may use one or more current or future thin film deposition techniques to implement one or more of the process steps disclosed.
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925 word line
"Word line" refers to a structure within a memory array comprising a set of memory cells. The memory array is configured such that the operational memory cells of the word line are read or sensed during a read operation. Similarly, the memory array is configured such that the operational memory cells of the word line are read, or sensed, during a read operation. A word line may also be referred to as a physical page or page for short. "Word line" refers to a structure within a memory array comprising a set of memory cells. The memory array is configured such that the operational memory cells of the word line are read or sensed during a read operation. Similarly, the memory array is configured such that the operational memory cells of the word line are read, or sensed, during a read operation. A word line may also be referred to as a physical page or page for short.
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759 storage controller
"Storage controller" refers to any hardware, device, component, element, or circuit configured to manage data operations on non-volatile memory media, and may comprise one or more processors, programmable processors (e.g., FPGAs), ASICs, micro-controllers, or the like. In some embodiments, the storage controller is configured to store data on and/or read data from non-volatile memory media, to transfer data to/from the non-volatile memory device(s), and so on. "Storage controller" refers to any hardware, device, component, element, or circuit configured to manage data operations on non-volatile memory media, and may comprise one or more processors, programmable processors (e.g., FPGAs), ASICs, micro-controllers, or the like. In some embodiments, the storage controller is configured to store data on and/or read data from non-volatile memory media, to transfer data to/from the non-volatile memory device(s), and so on.
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758 process, voltage, and temperature (PVT) spread
"Process, Voltage, and Temperature (PVT) spread" refers to process variations, voltage level differences, and temperature differences between two fabricated semiconductor devices, or variations that may be experienced by the same device under different operating conditions. PVT spread refers to a measure of how much one electronic component is influenced by PVT variations in relation to how much another electronic component is influenced by PVT variations. PVT spread refers to the differences in relation to one or more of process variation, voltage variations, and/or temperature variations.Process spread may occur due to differences in the manufacturing process from one wafer to another, or even from one die to another. The semiconductor manufacturing process is rigorously constrained for uniformity, but even minute differences in concentrations of a dopant, minute incursions of impurities, etc., may cause noticeable inconsistencies in the behavior of finished components. Temperature spread may occur due to both the difference in temperature effects in the circuitry at higher or lower die temperatures or when operating at different ambient temperatures. Voltage spread may occur due to different circuit behaviors at high or low voltages, when exposed to voltage fluctuations over time, etc. All of these effects may cause a component meeting the same theoretical design parameters to behave differently from similar parts, or differently in one scenario than in another. "Process, Voltage, and Temperature (PVT) spread" refers to process variations, voltage level differences, and temperature differences between two fabricated semiconductor devices, or variations that may be experienced by the same device under different operating conditions. PVT spread refers to a measure of how much one electronic component is influenced by PVT variations in relation to how much another electronic component is influenced by PVT variations. PVT spread refers to the differences in relation to one or more of process variation, voltage variations, and/or temperature variations.Process spread may occur due to differences in the manufacturing process from one wafer to another, or even from one die to another. The semiconductor manufacturing process is rigorously constrained for uniformity, but even minute differences in concentrations of a dopant, minute incursions of impurities, etc., may cause noticeable inconsistencies in the behavior of finished components. Temperature spread may occur due to both the difference in temperature effects in the circuitry at higher or lower die temperatures or when operating at different ambient temperatures. Voltage spread may occur due to different circuit behaviors at high or low voltages, when exposed to voltage fluctuations over time, etc. All of these effects may cause a component meeting the same theoretical design parameters to behave differently from similar parts, or differently in one scenario than in another.
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748 storage operation
"Storage operation" refers to an operation performed on, within, to, or in relation to, a non-volatile storage device and/or non-volatile storage media. Examples of storage operations include, but are not limited to, a data refresh operation, a data scrub operation, a garbage collection operation, an erase operation, a maintenance operation, a test mode operation, a program storage operation, a read scan operation, a host memory buffer access operation, a host memory buffer maintenance operation, a cache access operation, a cache maintenance operation, a memory address translation lookup operation, a memory address translation cache swapping/paging operation, and the like. Further examples of storage operations include but are not limited to, reading data from (or sensing a state of) a memory cell, writing (or programming) data to a memory cell, and/or erasing data stored in a memory cell. "Storage operation" refers to an operation performed on, within, to, or in relation to, a non-volatile storage device and/or non-volatile storage media. Examples of storage operations include, but are not limited to, a data refresh operation, a data scrub operation, a garbage collection operation, an erase operation, a maintenance operation, a test mode operation, a program storage operation, a read scan operation, a host memory buffer access operation, a host memory buffer maintenance operation, a cache access operation, a cache maintenance operation, a memory address translation lookup operation, a memory address translation cache swapping/paging operation, and the like. Further examples of storage operations include but are not limited to, reading data from (or sensing a state of) a memory cell, writing (or programming) data to a memory cell, and/or erasing data stored in a memory cell.
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732 zone metric FSP1747 9/11/25, 10:56 PM Edit
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731 zone health FSP1747 9/11/25, 10:56 PM Edit
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2033 PER-12 vertex
"Vertex" refers to a point at which lines, structures, trajectories, or pathways intersect. "Vertex" refers to a point at which lines, structures, trajectories, or pathways intersect.
PER-12PROV 9/10/25, 4:49 PM Add Term Edit
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1485 CES-16 side
As used herein, “side” refers to a structure or part of a structure including, but not limited to: one of a longer bounding surfaces or lines of an object especially contrasted with the ends, a line or surface forming a border or face of an object, either surface of a thin object, a bounding line or structure of a geometric figure or shape, and the like. A side can also refer to a geometric edge of a polygon (two-dimensional shape) and/or a face or surface of a polyhedron (three-dimensional shape). Side can also refer to a location on a structure. For example, a side can be a location on a structure at, or near, a furthest position away from a central axis of the structure. As used herein, the term “side” can include one or more modifiers that define and/or orient and/or distinguish the side of an object from others based on based on where and/or how the object is deployed within or in relation to a second object. For example, in the context of an implant for a patient, sides of the implant may be labeled based on where the sides are relative to the patient when the implant is deployed. As one example, an “anterior side” of an implant, instrument, anatomical structure, or other structure refers to a side that is anterior to other sides of the structure in relation to a patient when the structure is deployed in the patient. As another example, in the context of an instrument used with a patient, sides of the instrument may be labeled based on where the sides are when the instrument is being used for its purpose. As one example, a “front side” of an instrument refers to a side that is facing a user of the instrument when the instrument is in use. As used herein, “side” refers to a structure or part of a structure including, but not limited to: one of a longer bounding surfaces or lines of an object especially contrasted with the ends, a line or surface forming a border or face of an object, either surface of a thin object, a bounding line or structure of a geometric figure or shape, and the like. A side can also refer to a geometric edge of a polygon (two-dimensional shape) and/or a face or surface of a polyhedron (three-dimensional shape). Side can also refer to a location on a structure. For example, a side can be a location on a structure at, or near, a furthest position away from a central axis of the structure. As used herein, the term “side” can include one or more modifiers that define and/or orient and/or distinguish the side of an object from others based on based on where and/or how the object is deployed within or in relation to a second object. For example, in the context of an implant for a patient, sides of the implant may be labeled based on where the sides are relative to the patient when the implant is deployed. As one example, an “anterior side” of an implant, instrument, anatomical structure, or other structure refers to a side that is anterior to other sides of the structure in relation to a patient when the structure is deployed in the patient. As another example, in the context of an instrument used with a patient, sides of the instrument may be labeled based on where the sides are when the instrument is being used for its purpose. As one example, a “front side” of an instrument refers to a side that is facing a user of the instrument when the instrument is in use.
CES-16 9/10/25, 4:48 PM Add Term Edit
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1431 OPT-9 resection
As used herein, a "resection" refers to a method, procedure, or step that removes tissue from another anatomical structure or body. A resection can include an osteotomy that cuts through a bone or other tissue because the osteotomy still removes at least a minimal amount of tissue. A resection is typically performed by a surgeon on a part of a body of a patient. A resection is one type of osteotomy. In certain embodiments, a resection may remove little or no tissue and may in such circumstances also be referred to as an incision or a dissection. Resection may be used as a noun or a verb. In the verb form, the term is "resect" and refers to an act of performing, or doing, a resection. Past tense of the verb resect is resected. As used herein, a "resection" refers to a method, procedure, or step that removes tissue from another anatomical structure or body. A resection can include an osteotomy that cuts through a bone or other tissue because the osteotomy still removes at least a minimal amount of tissue. A resection is typically performed by a surgeon on a part of a body of a patient. A resection is one type of osteotomy. In certain embodiments, a resection may remove little or no tissue and may in such circumstances also be referred to as an incision or a dissection. Resection may be used as a noun or a verb. In the verb form, the term is "resect" and refers to an act of performing, or doing, a resection. Past tense of the verb resect is resected.
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1655 PER-10 “osteotomy” or osteotomy procedure or surgical osteotomy
As used herein, “osteotomy” or "osteotomy procedure" or "surgical osteotomy" refers to a surgical operation in which one or more bones are cut to shorten or lengthen them or to change their alignment. The procedure can include removing one or more portions of bone and/or adding one or more portions of bone or bone substitutes. As used herein, “osteotomy” or "osteotomy procedure" or "surgical osteotomy" refers to a surgical operation in which one or more bones are cut to shorten or lengthen them or to change their alignment. The procedure can include removing one or more portions of bone and/or adding one or more portions of bone or bone substitutes.
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1549 IPP-0050-US35 nextremity interface or engagement interface
As used herein, an "interface," "user interface," or "engagement interface" refers to an area, a boundary, structure, or a place at which two separate and/or independent structures, members, apparatus, assemblies, components, and/or systems join, connect, are coupled, or meet and act on, or communicate, mechanically and/or electronically, with each other. In certain embodiments, "interface" may refer to a surface forming a common boundary of two bodies, spaces, structures, members, apparatus, assemblies, components, or phases. In certain embodiments, the term interface may be used with an adjective that identifies a type or function for the interface. For example, an engagement or coupling interface may refer to one or more structures that interact, connect, or couple to mechanically join or connect two separate structures, each connected to a side of the interface. In another example, a user interface may refer to one or more mechanical, electrical, or electromechanical structures that interact with or enable a user to provide user input, instructions, input signals, data, or data values and receive output, output data, or feedback. As used herein, an "interface," "user interface," or "engagement interface" refers to an area, a boundary, structure, or a place at which two separate and/or independent structures, members, apparatus, assemblies, components, and/or systems join, connect, are coupled, or meet and act on, or communicate, mechanically and/or electronically, with each other. In certain embodiments, "interface" may refer to a surface forming a common boundary of two bodies, spaces, structures, members, apparatus, assemblies, components, or phases. In certain embodiments, the term interface may be used with an adjective that identifies a type or function for the interface. For example, an engagement or coupling interface may refer to one or more structures that interact, connect, or couple to mechanically join or connect two separate structures, each connected to a side of the interface. In another example, a user interface may refer to one or more mechanical, electrical, or electromechanical structures that interact with or enable a user to provide user input, instructions, input signals, data, or data values and receive output, output data, or feedback.
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1373 VIL-12 arthroplasty procedure and arthroplasty implant
As used herein, an “arthroplasty procedure” refers to a surgical procedure for restoring and / or improving function and / or operation of a joint of a patient. An arthroplasty procedure can be done for a toe joint, ankle joint, knee joint, hip joint, arm joint, elbow joint, finger joint, or the like. In certain embodiments, an arthroplasty can include replacing, remodeling, resurfacing, or realigning an articular surface of a musculoskeletal joint by osteotomy or some other procedure. An arthroplasty procedure may be an elective procedure to relieve pain and/or restore function to a joint after damage by arthritis or some type of trauma. An "arthroplasty implant" is an implant used in an arthroplasty procedure. As used herein, an “arthroplasty procedure” refers to a surgical procedure for restoring and / or improving function and / or operation of a joint of a patient. An arthroplasty procedure can be done for a toe joint, ankle joint, knee joint, hip joint, arm joint, elbow joint, finger joint, or the like. In certain embodiments, an arthroplasty can include replacing, remodeling, resurfacing, or realigning an articular surface of a musculoskeletal joint by osteotomy or some other procedure. An arthroplasty procedure may be an elective procedure to relieve pain and/or restore function to a joint after damage by arthritis or some type of trauma. An "arthroplasty implant" is an implant used in an arthroplasty procedure.
OPT-9 9/10/25, 4:45 PM Add Term Edit
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1463 INS-4PROV implant
As used herein, "implant" refers to a medical device manufactured to replace a missing biological structure, support a damaged biological structure, or enhance an existing biological structure. Often medical implants are man-made devices, but implants can also be natural occurring structures. The surface of implants that contact the body may be made of, or include a biomedical material such as titanium, cobalt chrome, stainless steel, carbon fiber, another metallic alloy, silicone, polymer, Synthetic polyvinyl alcohol (PVA) hydrogels, biomaterials, biocompatible polymers such as PolyEther Ether Ketone (PEEK) or a polylactide polymer (e.g. PLLA) and/or others, or apatite, or any combination of these depending on what is functional and/or economical. Implants can have a variety of configurations and can be wholly, partially, and/or include a number of components that are flexible, semiflexible, pliable, elastic, supple, semi-rigid, or rigid. In some cases implants contain electronics, e.g. artificial pacemaker and cochlear implants. Some implants are bioactive, such as subcutaneous drug delivery devices in the form of implantable pills or drug-eluting stents. Orthopedic implants may be used to alleviate issues with bones and/or joints of a patient's body. Some implants can include components such as electronic components, circuits, electromechanical components, or the like. Orthopedic implants can be used to treat bone fractures, osteoarthritis, scoliosis, spinal stenosis, discomfort, and pain. Examples of orthopedic implants include, but are not limited to, a wide variety of pins, rods, screws, anchors, spacers, sutures, all-suture implants, ball all-suture implants, self-locking suture implants, cross-threaded suture implants, plates used to anchor fractured bones while the bones heal or fuse together, and the like. As used herein, "implant" refers to a medical device manufactured to replace a missing biological structure, support a damaged biological structure, or enhance an existing biological structure. Often medical implants are man-made devices, but implants can also be natural occurring structures. The surface of implants that contact the body may be made of, or include a biomedical material such as titanium, cobalt chrome, stainless steel, carbon fiber, another metallic alloy, silicone, polymer, Synthetic polyvinyl alcohol (PVA) hydrogels, biomaterials, biocompatible polymers such as PolyEther Ether Ketone (PEEK) or a polylactide polymer (e.g. PLLA) and/or others, or apatite, or any combination of these depending on what is functional and/or economical. Implants can have a variety of configurations and can be wholly, partially, and/or include a number of components that are flexible, semiflexible, pliable, elastic, supple, semi-rigid, or rigid. In some cases implants contain electronics, e.g. artificial pacemaker and cochlear implants. Some implants are bioactive, such as subcutaneous drug delivery devices in the form of implantable pills or drug-eluting stents. Orthopedic implants may be used to alleviate issues with bones and/or joints of a patient's body. Some implants can include components such as electronic components, circuits, electromechanical components, or the like. Orthopedic implants can be used to treat bone fractures, osteoarthritis, scoliosis, spinal stenosis, discomfort, and pain. Examples of orthopedic implants include, but are not limited to, a wide variety of pins, rods, screws, anchors, spacers, sutures, all-suture implants, ball all-suture implants, self-locking suture implants, cross-threaded suture implants, plates used to anchor fractured bones while the bones heal or fuse together, and the like.
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2202 TMC-PAT-5 rasp feature
"Rasp feature," as used herein, refers to a feature and/or a structural component of a cutting instrument, such as a rasp and/or rasp blade, or the like configured to abrade, grind, shape, contour, or refine surfaces during a procedure. The rasp feature enhances the cutting instrument’s versatility by enabling both precise cutting and controlled surface sculpting. In some embodiments, the rasp feature comprises a plurality of raised protrusions, serrations, ridges, or teeth disposed along at least a portion of an instrument’s working surface, such as a planar surface, an edge, a distal end, a distal surface, and/or a lateral face thereof. These protrusions may be arranged in a pattern, such as linear rows, arcuate rows, a grid, or an irregular array, and are sized and shaped to remove material incrementally through frictional engagement, thereby smoothing and/or contouring the surface rather than solely incising the surface. For example, the rasp feature may include teeth or protrusions with a height ranging from approximately about 0.1 mm to about 2 mm and a spacing of approximately about 0.5 mm to about 5 mm, though other dimensions are contemplated depending on the intended application. Alternatively, the rasp feature may be embodied as a textured surface, such as a roughened, etched, or grit-coated area, applied to the instrument’s working surface to facilitate abrasion through microscopic or macroscopic surface irregularities. Such a textured surface may be achieved, for instance, through chemical etching, laser texturing, or the application of an abrasive coating, providing a uniform or patterned roughness with a surface roughness average (Ra) ranging from approximately 0.5 µm to 50 µm, depending on the desired abrasiveness. The rasp feature, whether formed as protrusions, serrations, teeth, or a textured surface, may be integrally formed with the instrument body, such as through machining, molding, or surface treatment, or may be a distinct element affixed thereto, such as a coated abrasive layer. This flexibility in construction allows the rasp feature to be adapted to various manufacturing processes and instrument designs, supporting a range of applications where both cutting and/or surface refinement are desired. "Rasp feature," as used herein, refers to a feature and/or a structural component of a cutting instrument, such as a rasp and/or rasp blade, or the like configured to abrade, grind, shape, contour, or refine surfaces during a procedure. The rasp feature enhances the cutting instrument’s versatility by enabling both precise cutting and controlled surface sculpting. In some embodiments, the rasp feature comprises a plurality of raised protrusions, serrations, ridges, or teeth disposed along at least a portion of an instrument’s working surface, such as a planar surface, an edge, a distal end, a distal surface, and/or a lateral face thereof. These protrusions may be arranged in a pattern, such as linear rows, arcuate rows, a grid, or an irregular array, and are sized and shaped to remove material incrementally through frictional engagement, thereby smoothing and/or contouring the surface rather than solely incising the surface. For example, the rasp feature may include teeth or protrusions with a height ranging from approximately about 0.1 mm to about 2 mm and a spacing of approximately about 0.5 mm to about 5 mm, though other dimensions are contemplated depending on the intended application. Alternatively, the rasp feature may be embodied as a textured surface, such as a roughened, etched, or grit-coated area, applied to the instrument’s working surface to facilitate abrasion through microscopic or macroscopic surface irregularities. Such a textured surface may be achieved, for instance, through chemical etching, laser texturing, or the application of an abrasive coating, providing a uniform or patterned roughness with a surface roughness average (Ra) ranging from approximately 0.5 µm to 50 µm, depending on the desired abrasiveness. The rasp feature, whether formed as protrusions, serrations, teeth, or a textured surface, may be integrally formed with the instrument body, such as through machining, molding, or surface treatment, or may be a distinct element affixed thereto, such as a coated abrasive layer. This flexibility in construction allows the rasp feature to be adapted to various manufacturing processes and instrument designs, supporting a range of applications where both cutting and/or surface refinement are desired.
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2230 TMC-PAT-6PROV Bone cutting feature
"Bone cutting feature" refers to a structural element, portion, or part of a device, object, apparatus, or instrument specifically configured, designed, or engineered to engage, cut, abrade, shape, resect, or otherwise modify bone tissue or bone-like materials. A bone cutting feature may include cutting edges, cutting teeth, rasp features, abrasive surfaces, saw blades, wedge structures, or similar elements capable of removing or reshaping bone. The bone cutting feature may vary in geometry, dimensions, or characteristics depending on factors such as intended surgical or medical application, the type or condition of bone tissue targeted, and desired clinical outcomes. Bone cutting features may be found on various components, instruments, or tools, including, without limitation, wedge osteotomy blades, rasp blades, surgical saws, bone burrs, milling cutters, drills, reamers, surgical implants, or other bone-modifying surgical instruments. "Bone cutting feature" refers to a structural element, portion, or part of a device, object, apparatus, or instrument specifically configured, designed, or engineered to engage, cut, abrade, shape, resect, or otherwise modify bone tissue or bone-like materials. A bone cutting feature may include cutting edges, cutting teeth, rasp features, abrasive surfaces, saw blades, wedge structures, or similar elements capable of removing or reshaping bone. The bone cutting feature may vary in geometry, dimensions, or characteristics depending on factors such as intended surgical or medical application, the type or condition of bone tissue targeted, and desired clinical outcomes. Bone cutting features may be found on various components, instruments, or tools, including, without limitation, wedge osteotomy blades, rasp blades, surgical saws, bone burrs, milling cutters, drills, reamers, surgical implants, or other bone-modifying surgical instruments.
TMC-PAT-6PROV 9/10/25, 4:43 PM Add Term Edit
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2216 TMC-PAT-5 fine rasp feature
"Fine rasp feature" refers to a rasp feature or a set of rasp features that are configured to remove a target material at a slower rate than a coarse rasp feature or non coarse rasp feature while producing a smoother surface finish. A fine rasp feature may remove smaller portions of the target material due to decreased spacing, shallower depth, or less aggressive geometry of the rasp structure. The material removal may occur in finer particles, shavings, or dust, depending on the geometry of the rasp feature and the properties of the target material. A fine rasp feature may be used for applications requiring precise material removal and improved surface refinement and may be selected based on the desired balance between cutting efficiency and surface finish quality. "Fine rasp feature" refers to a rasp feature or a set of rasp features that are configured to remove a target material at a slower rate than a coarse rasp feature or non coarse rasp feature while producing a smoother surface finish. A fine rasp feature may remove smaller portions of the target material due to decreased spacing, shallower depth, or less aggressive geometry of the rasp structure. The material removal may occur in finer particles, shavings, or dust, depending on the geometry of the rasp feature and the properties of the target material. A fine rasp feature may be used for applications requiring precise material removal and improved surface refinement and may be selected based on the desired balance between cutting efficiency and surface finish quality.
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2215 TMC-PAT-5 coarse rasp feature
"Coarse rasp feature" refers to a rasp feature or a set of rasp features that are configured to remove a target material at a faster rate than a non-coarse rasp feature. A coarse rasp feature may remove larger portions of the target material due to increased spacing, depth, or aggressiveness of the rasp feature. The material removal may occur in larger fragments, chips, or sections, depending on the geometry of the rasp feature and the properties of the target material. A coarse rasp feature may be used for applications requiring rapid material removal and may be selected based on the desired balance between speed and surface finish quality. "Coarse rasp feature" refers to a rasp feature or a set of rasp features that are configured to remove a target material at a faster rate than a non-coarse rasp feature. A coarse rasp feature may remove larger portions of the target material due to increased spacing, depth, or aggressiveness of the rasp feature. The material removal may occur in larger fragments, chips, or sections, depending on the geometry of the rasp feature and the properties of the target material. A coarse rasp feature may be used for applications requiring rapid material removal and may be selected based on the desired balance between speed and surface finish quality.
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1425 FLO-4 feature
As used herein, "feature" refers to a distinctive attribute or aspect of something. A feature may include one or more apparatuses, structures, objects, systems, sub-systems, devices, or the like. A feature may include a modifier that identifies a particular function or operation and/or a particular structure relating to the feature. Examples of such modifiers applied to a feature, include, but are not limited to, "rasp feature," "attachment feature," "bone attachment feature," "securing feature," "placement feature," "protruding feature," "engagement feature," "disengagement feature," “resection feature”, “guide feature”, “alignment feature”, and the like. As used herein, "feature" refers to a distinctive attribute or aspect of something. A feature may include one or more apparatuses, structures, objects, systems, sub-systems, devices, or the like. A feature may include a modifier that identifies a particular function or operation and/or a particular structure relating to the feature. Examples of such modifiers applied to a feature, include, but are not limited to, "rasp feature," "attachment feature," "bone attachment feature," "securing feature," "placement feature," "protruding feature," "engagement feature," "disengagement feature," “resection feature”, “guide feature”, “alignment feature”, and the like.
FLO-4 9/10/25, 4:42 PM Add Term Edit
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2128 PER-23 bone wedge
"Bone Wedge" refers to a geometric shape of one or more bones characterized by having two flat, planar, and/or inclined sides or surfaces that converge to form an edge. A bone wedge resembles a triangular prism, with one end wider or thicker than the other. In certain implementations, the edge formed by the two converging sides is within a bone or set of bones from which the bone wedge is formed. In other implementations, the edge formed by the two converging sides is outside of a bone or set of bones from which the bone wedge is formed. "Bone Wedge" refers to a geometric shape of one or more bones characterized by having two flat, planar, and/or inclined sides or surfaces that converge to form an edge. A bone wedge resembles a triangular prism, with one end wider or thicker than the other. In certain implementations, the edge formed by the two converging sides is within a bone or set of bones from which the bone wedge is formed. In other implementations, the edge formed by the two converging sides is outside of a bone or set of bones from which the bone wedge is formed.
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