"Write operation" or “Write command” refers to a storage command configured to direct the recipient to write, or store, one or more data blocks on a persistent storage media, such as a hard disk drive, non-volatile memory media, or the like. A write command may include any storage command that may result in data being written to physical storage media of a storage device. The write operation may include enough data to fill one or more data blocks, or the write operation may include enough data to fill a portion of one or more data blocks. In one embodiment, a write operation includes a starting LBA and a count indicating the number of LBA of data to write to on the storage media. … more "Write operation" or “Write command” refers to a storage command configured to direct the recipient to write, or store, one or more data blocks on a persistent storage media, such as a hard disk drive, non-volatile memory media, or the like. A write command may include any storage command that may result in data being written to physical storage media of a storage device. The write operation may include enough data to fill one or more data blocks, or the write operation may include enough data to fill a portion of one or more data blocks. In one embodiment, a write operation includes a starting LBA and a count indicating the number of LBA of data to write to on the storage media.

"Memory die" refers to a small piece of semiconducting material on which a given functional circuit is fabricated. Typically, integrated circuits are produced in large batches on a single wafer of electronic-grade silicon (EGS) or other semiconductor (such as GaAs) through processes such as photolithography. The wafer is cut (diced) into many pieces, each containing one copy of the circuit. Each of these pieces is called a die or memory die. (Search 'die (integrated circuit)' on Wikipedia.com Oct. 9, 2019. Accessed Nov. 18, 2019.) … more "Memory die" refers to a small piece of semiconducting material on which a given functional circuit is fabricated. Typically, integrated circuits are produced in large batches on a single wafer of electronic-grade silicon (EGS) or other semiconductor (such as GaAs) through processes such as photolithography. The wafer is cut (diced) into many pieces, each containing one copy of the circuit. Each of these pieces is called a die or memory die. (Search 'die (integrated circuit)' on Wikipedia.com Oct. 9, 2019. Accessed Nov. 18, 2019.)

"Parity section" refers to one part of a storage block. A parity section stores XOR parity data for a set of parity bins that enable a data recovery process for one, or both of, physical pages within a logical page of the storage block and one or more logical pages of the storage block.In one embodiment, a parity section includes one or more parity rows. In a storage block that stores a single bit per memory cell, the storage block may include a single parity row. In a storage block that stores a multiple bits per memory cell (e.g., MLC, TLC, QLC, PLC), the storage block may include a parity row associated with each level of bits stored within the memory cells. For example, three parity rows for storage blocks storing three bits per cells. Four parity rows for storage blocks storing four bits per cells. … more "Parity section" refers to one part of a storage block. A parity section stores XOR parity data for a set of parity bins that enable a data recovery process for one, or both of, physical pages within a logical page of the storage block and one or more logical pages of the storage block.In one embodiment, a parity section includes one or more parity rows. In a storage block that stores a single bit per memory cell, the storage block may include a single parity row. In a storage block that stores a multiple bits per memory cell (e.g., MLC, TLC, QLC, PLC), the storage block may include a parity row associated with each level of bits stored within the memory cells. For example, three parity rows for storage blocks storing three bits per cells. Four parity rows for storage blocks storing four bits per cells.

"XOR parity data" refers to a particular type of parity data. Parity data refers to one or more bits associated with a string of binary code (set of ordered binary bits). Parity bits, and parity data, may be used as the simplest form of error detecting code. Parity bits, and parity data, may generally be applied to the smallest units of a communication protocol or data being exchanged, typically 8-bit octets (a byte), although parity data can also be applied separately to an entire message string of bits or set of data. (Search "parity bit" on Wikipedia.com May 9, 2020. Modified. Accessed May 20, 2020.)XOR parity data is a particular type of parity data that may be used to leverage a property of an XOR operation in which an XOR operation is its own inverse. XOR parity data may be combined for multiple sets of commonly configured data to enable error correction of the data through a reverse XOR operation. This combining is referred to herein as accumulating XOR parity data (e.g., accumulating XOR parity data).In certain embodiments, XOR parity data may comprise an XOR result from a bitwise XOR operation of a string of binary data being protected and another XOR result or an initial parity data set, such as a set of zeros. XOR parity data may also be used with the XOR binary function to recover a set of data, provided a copy of each data set used to generate an XOR parity data result is available except for the data set being recovered. … more "XOR parity data" refers to a particular type of parity data. Parity data refers to one or more bits associated with a string of binary code (set of ordered binary bits). Parity bits, and parity data, may be used as the simplest form of error detecting code. Parity bits, and parity data, may generally be applied to the smallest units of a communication protocol or data being exchanged, typically 8-bit octets (a byte), although parity data can also be applied separately to an entire message string of bits or set of data. (Search "parity bit" on Wikipedia.com May 9, 2020. Modified. Accessed May 20, 2020.)XOR parity data is a particular type of parity data that may be used to leverage a property of an XOR operation in which an XOR operation is its own inverse. XOR parity data may be combined for multiple sets of commonly configured data to enable error correction of the data through a reverse XOR operation. This combining is referred to herein as accumulating XOR parity data (e.g., accumulating XOR parity data).In certain embodiments, XOR parity data may comprise an XOR result from a bitwise XOR operation of a string of binary data being protected and another XOR result or an initial parity data set, such as a set of zeros. XOR parity data may also be used with the XOR binary function to recover a set of data, provided a copy of each data set used to generate an XOR parity data result is available except for the data set being recovered.

a device, component, circuit, system, logic, chip, or circuitry configured to detect, sense, and/or measure a temperature of an object, an apparatus, a circuit, a component, ambient air, and/or the like. One example of a temperature sensor is a semiconductor based temperature sensor which may be fabricated together with the semiconductor. … more a device, component, circuit, system, logic, chip, or circuitry configured to detect, sense, and/or measure a temperature of an object, an apparatus, a circuit, a component, ambient air, and/or the like. One example of a temperature sensor is a semiconductor based temperature sensor which may be fabricated together with the semiconductor.

a device, component, circuit, system, chip, or circuitry configured to detect, sense, and/or measure a temperature of a thing, an apparatus, a circuit, a component, and/or the like. … more a device, component, circuit, system, chip, or circuitry configured to detect, sense, and/or measure a temperature of a thing, an apparatus, a circuit, a component, and/or the like.

any suitable technology that can implement a temperature sensor, including technology currently employed in conventional memory die temperature sensors. Also, it should be noted that while the temperature sensor may be located in the memory die in this embodiment, the temperature sensor may be located in another component in the storage system, such as the controller, or can be a separate component in the storage system. … more any suitable technology that can implement a temperature sensor, including technology currently employed in conventional memory die temperature sensors. Also, it should be noted that while the temperature sensor may be located in the memory die in this embodiment, the temperature sensor may be located in another component in the storage system, such as the controller, or can be a separate component in the storage system.