Matter US11302645
Printed circuit board compensation structure for high bandwidth and high die-count memory stacks
Matter Number
US11302645
Application Id
83
May Reuse
1
Application Title
Printed circuit board compensation structure for high bandwidth and high die-count memory stacks
Pub Number
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Application Number
16/916784
Patent Number
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Application Category
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Attorney Matter Number
FSP1843
Authored By
David McKenzie
Filing Date
6/30/20
Created
8/16/22, 5:33 AM
Modified
8/18/22, 8:13 PM
Url Pdf
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Assignee
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Abstract
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Description
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