| Matter Number | US11302645 | Application Id | 83 |
|---|---|---|---|
| Application Title | Printed circuit board compensation structure for high bandwidth and high die-count memory stacks | Abstract | |
| Description | |||
| Pub Number | Application Number | 16/916784 | |
| Patent Number | Application Category | ||
| Attorney Matter Number | FSP1843 | Authored By | David McKenzie |
| Source URL | Open URL | Source PDF | Open PDF |
| May Reuse | 1 | Filing Date | 6/30/20 |
| Created | 8/16/22, 5:33 AM | Modified | 8/18/22, 8:13 PM |