Term #1,845
via
Claim Term
via
Origin matter
Printed circuit board compensation structure for high bandwidth and high die-count memory stacks
Reference Case 1
US11302645
Date Added
8/18/22
Created
8/18/22, 8:23 PM
Modified
8/18/22, 8:23 PM
Full Desc
“Via” refers to a conductive structure configured to electrically connect a conductor on one level of a multilayer metal stack to another conductor on another level of the multilayer metal stack. Vias may be made of a variety of conductive materials. Often vias are made from tungsten and may be referred to as ‘plugs’ or ‘contact plugs.’
Applications using this term
| Matter | Usage | Notes | Actions |
|---|---|---|---|
| US11302645 | Defined | — | App terms |