16/146,238

Paragraph Number

108

In some example embodiments, the end die 310 is a "dummy" die for the die group 306, in that it only has I/O contact pads and ODT resistance circuits coupled to the transmission lines 134, and/or its sole function is to provide memory-side termination resistances for the transmission lines 134. For other example embodiments, such as the one shown in FIG. 3, the end die 310 includes additional circuitry 330--i.e., in addition to I/O contact pads and ODT resistance circuits. The additional circuitry 330 may be configured to perform one or more functions for the memory system 100 other than provide a memory-side termination resistance for the transmission lines 134. For example, in some example embodiments, the end die 310 is another one of the memory dies 104, configured to store data, like the memory dies 304. Accordingly, the additional circuitry 330 includes at least some of the components of the memory die 104 shown in FIG. 2B. In other example embodiments, the additional circuitry 330 includes error correction circuitry that is configured to detect and/or correct for errors in signals communicated over the transmission lines 134, and/or perform diagnostics such as parity checks or bit error rate estimation. Other types of additional circuitry 330, and/or functions other than those for storing data, performing error correction or detection, or other diagnostics, may be possible.

Added by DJM 12 2021