16/146,238

Paragraph Number

107

In various example methods of operation, when the controller die 102 and the memory dies 304 communicate with each other over the transmission line 308--either by the controller die 102 transmitting a signal over the transmission line 308 to the memory dies 304, or one of the memory dies 304 transmitting a signal over the transmission line 308 to the controller die 102--the ODT resistance circuit 328 is set to the low resistance level. In some embodiments, the controller die 102 and the memory die 304 may be configured to communicate with each other over the transmission line 308 at different frequencies, including a high frequency and a low frequency. The high frequency and the low frequency may be predetermined values, where, in general, the high frequency is a higher value than the low frequency. During communication over the transmission line 308, whether the ODT resistance circuit 328 is set to the high level or the low level may depend on whether signal communicated over the transmission line is communicated at the high frequency or the low frequency. For such embodiments, when the controller die 102 and the memory dies 304 communicate at the high frequency, the end die 310 has the ODT resistance circuit 328 set to the low resistance level. Alternatively, when the controller die 102 and the memory dies 304 communicate at the low frequency, the end die 310 has the ODT resistance circuit 328 set to the high resistance level.

Added by DJM 12 2021