Paragraph 80
Paragraph 80
Application
Dedicated termination dies for memory systems
Matter Number
FSP1845
Paragraph Number
80
Application Number
16/146,238
Reference Case 1
FSP1845
Reference Case 2
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Created
12/22/21, 12:00 AM
Modified
12/22/21, 12:00 AM
Id
6,593
Content
Additionally, the wire bond portion 320 may include an (N+1)-number of wire bond elements (WBE) (or just wire bonds) 320(1) to 320(N+1), and the I/O contact pad portion 322 may include an (N+1)-number of I/O contact pads 322(1) to 322(N+1). Each of the I/O contact pads 322 may be integrated with, such as by being disposed on, a respective one of the memory dies 304 or the end die 310 of the die group 306. For at least some example configurations, such as the one shown in FIG. 3, a first wire bond 320(1) includes a first end connected to the second packaging contact point 326 and a second end connected to the I/O contact pad 322(1) of the first memory die 304(1). The other wire bond elements of the wire bond portion 320 may have each of the ends connected to an I/O contact pad of two different dies of the die group 306. For example, as shown in FIG. 3, a second wire bond 320(2) has a first end connected to the I/O contact pad 322(1) of the first memory die 304(1) and a second end connected to the I/O contact pad 322(2) of the second memory die 304(2); a third wire bond 320(3) has a first end connected to the I/O contact pad 322(2) of the second memory die 304(2) and a second end connected to the I/O contact pad 322(3) of a third memory die 304(3) (not shown); an Nth wire bond 320(N) has a first end connected to an I/O contact pad 322(N-1) of an (N-1)th memory die 304(N-1) (not shown) and a second end connected to an I/O contact pad 322(N) of the Nth memory die 304(N); and an (N+1)th wire bond 320(N) has a first end connected to the I/O contact pad 322(N) of the Nth memory die 304(N) and a second end connected to the I/O contact pad 322(N+1) of the end die 310.
Notes
Added by DJM 12 2021