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Application
2380.2.01
US-20150012794-A1
US-20150205664-A1
US-20100023800-A1
US-8737141-A1
US-10157004-B2
US10007433A1
US-9159419-B2
US-10114589-A1
US-10134728-A1
US-20200065270-A1
US-10637533-B2
US-9927986-A1
US-8380915-A1
US-9159419-A1
US-9208071-A1
US-20200098728-A1
US-10643676-A1
US-10468073-B2
US-10283200-A1
US-10461965-B1
US-20130279232-A1
US-8892980-B2
US9632727A1
US10558561A1
US20100023800A1
US7230213A1
OPT-9
FLO-2
FLO-5PROV
ONSO3175(B) - Onsemi378
ONSO3305US - Onsemi346
GTS-3DES
FLO-4
US8762658B2
US8533406B2
US9632727B2
KMN-1PROV
PAT-2
PER-8 PROV
PER-9 PROV
INS-4PROV
HAR-1
CES-16
NXT-5PROV NXT-5, 6, 7, 8
IPP-0051-US14 cross roads
FLO-7PROV
IMI-5PROV
IPP-0050-US35 nextremity
VIL-12
OPT-13
TOY-1
US10998041B1
FSP1845
US6559866B2
Placeholder App
PER-10
KBR-1 1400.2.623
PER-13PROV
PAT-3
US20030023453
RMS-1DES
SMG-1DES
FLO-5
US10318495
US10133662B2
PER-11
US20140066758
VIL-17
PER-17
JBR-1
PER-12
US11056880
US11302645
US20210407565
US11081191
PON-1PROV, 2PROV, 3PROV
PER-33
RMT-1PROV
PER-32
PER-34
MCC-1
FLO-10
PER-14
PER-19
PER-22
PER-18
PER-24
TMC-PAT-1
DAR-2
PER-23
TMC-PAT-4
PER-16
PER-4 DIV1
PER-20
PER-21
BRT-PAT-1
TMC-PAT-5
TMC-PAT-6PROV
BRT-PAT-2-PROV
71212.157.USU1
FPR-PAT-1-PROV
71212.158.USP1
RMT-1
DAR-1PROV
DAR-2PROV
PON-1PROV
PON-2PROV
PON-3PROV
PER-18PROV
TMC-1PROV
TMC-2PROV
PER-13PCT
PER-13
PER-16PROV
PER-14PROV
PER-34PROV
TMC-4PROV
TMC-3
PAS-1PROV
VEH-1
PER-29DES
TEST.001
E2E-TEST.001
TEST-001
TEST-002
TEST-003
TEST-004
ZED006
FSP1011
GAV-PAT-1-PROV
Matter Number
Paragraph Number
80
Application Number
16/146,238
Reference Case 1
Reference Case 2
Content
Additionally, the wire bond portion 320 may include an (N+1)-number of wire bond elements (WBE) (or just wire bonds) 320(1) to 320(N+1), and the I/O contact pad portion 322 may include an (N+1)-number of I/O contact pads 322(1) to 322(N+1). Each of the I/O contact pads 322 may be integrated with, such as by being disposed on, a respective one of the memory dies 304 or the end die 310 of the die group 306. For at least some example configurations, such as the one shown in FIG. 3, a first wire bond 320(1) includes a first end connected to the second packaging contact point 326 and a second end connected to the I/O contact pad 322(1) of the first memory die 304(1). The other wire bond elements of the wire bond portion 320 may have each of the ends connected to an I/O contact pad of two different dies of the die group 306. For example, as shown in FIG. 3, a second wire bond 320(2) has a first end connected to the I/O contact pad 322(1) of the first memory die 304(1) and a second end connected to the I/O contact pad 322(2) of the second memory die 304(2); a third wire bond 320(3) has a first end connected to the I/O contact pad 322(2) of the second memory die 304(2) and a second end connected to the I/O contact pad 322(3) of a third memory die 304(3) (not shown); an Nth wire bond 320(N) has a first end connected to an I/O contact pad 322(N-1) of an (N-1)th memory die 304(N-1) (not shown) and a second end connected to an I/O contact pad 322(N) of the Nth memory die 304(N); and an (N+1)th wire bond 320(N) has a first end connected to the I/O contact pad 322(N) of the Nth memory die 304(N) and a second end connected to the I/O contact pad 322(N+1) of the end die 310.
Notes
Added by DJM 12 2021
Raw Data
<w:p w14:paraId="170A3F4B" w14:textId="77777777" w:rsidR="00EE2B08" w:rsidRDefault="00EE2B08"><w:r><w:t xml:space="preserve">Additionally, the wire bond portion 320 may include an (N+1)-number of wire bond elements (WBE) (or just wire bonds) 320(1) to 320(N+1), and the I/O contact pad portion 322 may include an (N+1)-number of I/O contact pads 322(1) to 322(N+1). Each of the I/O contact pads 322 may be integrated with, such as by being disposed on, a respective one of the memory dies 304 or the end die 310 of the die group 306. For at least some example configurations, such as the one shown in FIG. 3, a first wire bond 320(1) includes a first end connected to the second packaging contact point 326 and a second end connected to the I/O contact pad 322(1) of the first memory die 304(1). The other wire bond elements of the wire bond portion 320 may have each of the ends connected to an I/O contact pad of two different dies of the die group 306. For </w:t></w:r><w:r><w:lastRenderedPageBreak/><w:t>example, as shown in FIG. 3, a second wire bond 320(2) has a first end connected to the I/O contact pad 322(1) of the first memory die 304(1) and a second end connected to the I/O contact pad 322(2) of the second memory die 304(2); a third wire bond 320(3) has a first end connected to the I/O contact pad 322(2) of the second memory die 304(2) and a second end connected to the I/O contact pad 322(3) of a third memory die 304(3) (not shown); an Nth wire bond 320(N) has a first end connected to an I/O contact pad 322(N-1) of an (N-1)</w:t></w:r><w:proofErr w:type="spellStart"/><w:r><w:t>th</w:t></w:r><w:proofErr w:type="spellEnd"/><w:r><w:t xml:space="preserve"> memory die 304(N-1) (not shown) and a second end connected to an I/O contact pad 322(N) of the Nth memory die 304(N); and an (N+1)</w:t></w:r><w:proofErr w:type="spellStart"/><w:r><w:t>th</w:t></w:r><w:proofErr w:type="spellEnd"/><w:r><w:t xml:space="preserve"> wire bond 320(N) has a first end connected to the I/O contact pad 322(N) of the Nth memory die 304(N) and a second end connected to the I/O contact pad 322(N+1) of the end die 310. </w:t></w:r></w:p>
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