16455676

Paragraph Number

54

Referring to FIG. 4, a top view of an optically transmissive substrate 24 is illustrated. A method of forming a semiconductor package may include providing an optically transmissive substrate. Various methods of manufacturing semiconductor packages as described herein may be used including wafer level processes and panel level processes. Panel level processes may have cost and productivity advantages. Panel level processing may allow for parallel processing of more units of semiconductor packages in a given period compared with wafer level processes without the waste of having to process partial die that can occur in wafer level processing. Only a portion of a panel or substrate is illustrated in the following figures but it is understood that the processing continues for each of the various packages included in the remainder of the panel. The optically transmissive substrate includes a first side and a second side as illustrated in FIG. 3. The method includes forming a first redistribution layer (RDL) on a first side of the optically transmissive substrate over one of more scribe lines on the first side of the optically transmissive substrate. The first RDLs are illustrated over the scribe lines in both FIGS. 3 and 4. On the outer edges of the optically transmissive substrate, fragments of the first RDLs are illustrated because only a portion of a panel or substrate is illustrated in the following figures.

Added by DJM 3 2021