Term #1,880
QFN package
Claim Term
QFN package
Origin matter
PON-1PROV, 2PROV, 3PROV
Reference Case 1
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Date Added
8/24/22
Created
8/24/22, 5:18 PM
Modified
8/25/22, 9:16 PM
Full Desc
"QFN package" refers to a type of flat no-leads semiconductor packaging that encloses a die, semiconductor, or circuit, and exposes leads of the circuit for electrical connection to other components of an electronic circuit and/or a printed circuit board (PCB). A QFN package is a package that include planar leads that are exposed on four sides of one surface of the package. Flat no-leads semiconductor packaging is a near chip scale plastic encapsulated package made with a planar copper lead frame substrate. Flat no-leads semiconductor packaging include leads that remain within the perimeter of the sides of the package that include the leads. Because the leads do not extend beyond the perimeter of the sides of the package the packaging may be referred to as a no lead package. Perimeter lands on the package bottom provide electrical connections to the PCB. (Search “flat no-leads package” on Wikipedia.com March 26, 2022. Modified. Accessed Aug. 24, 2022.)
Applications using this term
| Matter | Usage | Notes | Actions |
|---|---|---|---|
| PON-1PROV, 2PROV, 3PROV | Defined | — | App terms |