Term #1,825
Process, Voltage, and Temperature (PVT) spread
Claim Term
Process, Voltage, and Temperature (PVT) spread
Reference Case 1
FSP1777
Date Added
8/16/22
Created
8/16/22, 5:25 AM
Modified
8/16/22, 5:26 AM
Full Desc
“Process, Voltage, and Temperature (PVT) spread” refers to process variations, voltage level differences, and temperature differences between two fabricated semiconductor devices, or variations that may be experienced by the same device under different operating conditions. PVT spread refers to a measure of how much one electronic component is influenced by PVT variations in relation to how much another electronic component is influenced by PVT variations. PVT spread refers to the differences in relation to one or more of process variation, voltage variations, and/or temperature variations.
Process spread may occur due to differences in the manufacturing process from one wafer to another, or even from one die to another. The semiconductor manufacturing process is rigorously constrained for uniformity, but even minute differences in concentrations of a dopant, minute incursions of impurities, etc., may cause noticeable inconsistencies in the behavior of finished components. Temperature spread may occur due to both the difference in temperature effects in the circuitry at higher or lower die temperatures or when operating at different ambient temperatures. Voltage spread may occur due to different circuit behaviors at high or low voltages, when exposed to voltage fluctuations over time, etc. All of these effects may cause a component meeting the same theoretical design parameters to behave differently from similar parts, or differently in one scenario than in another.
Applications using this term
| Matter | Usage | Notes | Actions |
|---|---|---|---|
| US11056880 | Defined | — | App terms |