Paragraph 89
Paragraph 89
Application
Dedicated termination dies for memory systems
Matter Number
FSP1845
Paragraph Number
89
Application Number
16/146,238
Reference Case 1
FSP1845
Reference Case 2
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Created
12/22/21, 12:00 AM
Modified
12/22/21, 12:00 AM
Id
6,602
Content
The staircase stack of dies 402 may also be configured with an N-number of wire bond elements 408. In particular, a first wire bond element 408(1) connects to the first I/O contact pad 406(1) of the first die 402(1) and to a contact pad 410 of the die substrate 404. In addition, the second through (N+1)th wire bonds 408(2) to 408(N+1) are each connected to two I/O contact pads 406 of two adjacent dies 402 in the staircase stack. For example, a second wire bond 408(2) is connected to the first I/O contact pad 406(1) on the first die 402(1) and the second I/O contact pad 406(2) of the second die 402(2); a third wire bond 408(3) connects to the second I/O contact pad 406(2) of the second die 402(2) and to the third I/O contact pad 406(3) of the third die 402(3); an Nth wire bond element 408(N) connects to an (N-1)th I/O contact pad 406(N-1) of an (N-1)th die 402(N-1) (not shown) and to the Nth I/O contact pad 406(N) of the Nth die 402(N); and (N+1)th wire bond element 408(N+1) connects to the Nth I/O contact pad 406(N) of an Nth die 402(N) and to the (N+1)th I/O contact pad 406(N+1) of the (N+1)th die 402(N+1).
Notes
Added by DJM 12 2021