Paragraph 87

Paragraph 87

Application: FSP1845

Matter Number FSP1845
Paragraph Number 87
Application Number 16/146,238
Reference Case 1 FSP1845
Reference Case 2
Created 12/22/21, 12:00 AM
Modified 12/22/21, 12:00 AM
Id 6,600
Content
In the example configuration shown in FIG. 4, the stack of dies 402 may be disposed on a die substrate 404. In particular, a first memory die 402(1) may be in contact with and/or be the closest of the memory dies 402 to the die substrate 404. The other memory dies 402(2)-402(N+1) are stacked on the first memory die 402(1) in a staircase configuration such that the second memory die 402(2) is disposed on the first memory die 402(1), the third memory die 402(3) is disposed on the second memory die 402(2), and the (N+1)th (or end) die 402(N+1) is disposed on an Nth memory die 402(N).
Notes Added by DJM 12 2021