16/146,238

Paragraph Number

87

In the example configuration shown in FIG. 4, the stack of dies 402 may be disposed on a die substrate 404. In particular, a first memory die 402(1) may be in contact with and/or be the closest of the memory dies 402 to the die substrate 404. The other memory dies 402(2)-402(N+1) are stacked on the first memory die 402(1) in a staircase configuration such that the second memory die 402(2) is disposed on the first memory die 402(1), the third memory die 402(3) is disposed on the second memory die 402(2), and the (N+1)th (or end) die 402(N+1) is disposed on an Nth memory die 402(N).

Added by DJM 12 2021