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Paragraph Number

84

The die group 306 may be configured in any of various ways within the memory system 100. In one example configuration, the die group 306 is configured as a die stack. In general, a given die may be a generally planar structure having two opposing planar surfaces, including a first planar surface and a second planar surface. In a die stack, the dies may be disposed on or "stacked" on top of one another, starting with a first or base die and extending in a direction perpendicular to planar surfaces of the dies. As a die stack, one planar surface of one die may face and/or contact a planar surface of a second die. Also, two dies are adjacent to each other where no other dies of the stack are disposed in between them. Also, in some example configurations, a first or base die may be disposed or mounted on a base substrate or a printed circuit board directly. A last die of the stack may be the die that is disposed furthest from the base substrate or printed circuit board on which the die stack is mounted.

Added by DJM 12 2021