16/146,238

Paragraph Number

83

The memory dies 304, the wire bond elements 320, and the I/O contact pad 322 are numbered in FIG. 3 to correspond to their respective positions in the transmission line 308. Given an index k, the higher the value of k, the further away a kth memory die 304(k), a kth wire bond element 314(k), and/or a kth I/O contact pad 316(k) are electrically along the transmission line 308 from the packaging portion 318, the PCB portion 316, and the controller die 102. In this context, the (N+1)th I/O contact pad 322(N+1) is the electrically furthest of the I/O contact pads 322 along the transmission line 308 from the packaging portion 318, the PCB portion 316, and/or the controller die 102, and, in turn, is or functions as a memory-side end or termination of the transmission line 308. In this context, the end die 310 is the die that is the furthest of the dies of the die group 306 from the packaging portion 318, the PCB portion 316, and/or the controller die 102 with reference to the transmission line 308. In addition or alternatively, the end die 310 is the die that includes the (N+1)th I/O contact pad 322(N+1) that functions as the memory-side end or termination of the transmission line 308.

Added by DJM 12 2021