16/146,238

Paragraph Number

82

The wire bonds 320 and the I/O contact pads 322, in combination, may form a part or a portion of the transmission line 308, with each wire bond 320 and each I/O contact pad 322 having positions relative to each other in the transmission line 308 that correspond to propagation delay or electrical distance from the packaging portion 318. A signal transmitted from the controller die 102 on the transmission line 308 may take a shorter amount of time to reach a given I/O contact pad 322 or a given wire bond element 320 that is positioned electrically closer to the packaging portion 318, compared to a given I/O contact pad or a given wire bond element positioned electrically farther from the packaging portion 318, along the transmission line 308.

Added by DJM 12 2021