Paragraph 81
Paragraph 81
Application
Dedicated termination dies for memory systems
Matter Number
FSP1845
Paragraph Number
81
Application Number
16/146,238
Reference Case 1
FSP1845
Reference Case 2
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Created
12/22/21, 12:00 AM
Modified
12/22/21, 12:00 AM
Id
6,594
Content
With respect to the packaging components and/or the transmission line 308, the die group 306 includes those dies that are mounted on the same die substrate 302, housed within the same outer encasing 312, and/or have I/O contact pads 322 coupled to wire bonds 320 that are connected in series from the packaging portion 318 to the (N+1)th I/O contact pad 316(N+1) of the end die 310.
Notes
Added by DJM 12 2021