6594

Application Dedicated termination dies for memory systems
Matter Number FSP1845 Reference Case 1 FSP1845
Created 12/22/21, 12:00 AM Modified 12/22/21, 12:00 AM
Application Number

16/146,238

Paragraph Number

81

Content

With respect to the packaging components and/or the transmission line 308, the die group 306 includes those dies that are mounted on the same die substrate 302, housed within the same outer encasing 312, and/or have I/O contact pads 322 coupled to wire bonds 320 that are connected in series from the packaging portion 318 to the (N+1)th I/O contact pad 316(N+1) of the end die 310.

Notes

Added by DJM 12 2021