Paragraph 79
Paragraph 79
Application
Dedicated termination dies for memory systems
Matter Number
FSP1845
Paragraph Number
79
Application Number
16/146,238
Reference Case 1
FSP1845
Reference Case 2
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Created
12/22/21, 12:00 AM
Modified
12/22/21, 12:00 AM
Id
6,592
Content
In addition, the packaging portion 318 of the transmission line 308 may be configured to communicate signals between the PCB signal portion 316 and the wire bond portion 320. The packaging portion 318 may include a first packaging contact point 324 that connects to the PCB portion 316 in order to communicate signals between the PCB portion 316 and the packaging portion 318, and a second packaging contact point 326 that connects to the wire bond portion 320 in order to communicate signals between the packaging portion 318 and the wire bond portion 320. The packaging portion 318, including the first and second contact points 324, 326, may include any of various conductive elements and/or combinations of conductive elements to communicate signals between the PCB portion 316 and the wire bond portion 320, examples of which include solder balls, such as those of a ball grid array structure, vias, and/or traces integrated in the die substrate 302, contact pads, and wire bonds. Various configurations of the packaging portion 318 for connecting the PCB portion 316 with the wire bond portion 320 are possible.
Notes
Added by DJM 12 2021