16/146,238

Paragraph Number

73

In the example configuration shown in FIG. 3, the group of dies 306, including the memory dies 304 and the end die 310, may be configured in and/or integrated with a packaging that includes various packaging components, including a package or die substrate 302 on which the die group 306 is disposed or mounted, and an outer encasing or cover 312 that encases, covers, houses, and/or protects the dies of the die group 306. Other packaging components may be included, such as traces and vias integrated in the die substrate 302, solder balls, contact pads, and/or wire bonds, as non-limiting examples, at least some of which are described in further detail below. The controller die 102 may be configured and/or implemented as its own chip and/or integrated with its own packaging separate to that of the die group 306. (For simplicity, packaging components of the controller die 102 are not shown in FIG. 3). The controller die 102 and the die group 306 integrated with the packaging may be integrated, mounted, or disposed on a printed circuit board 314, as shown in FIG. 3.

Added by DJM 12 2021