16/146,238

Paragraph Number

69

Additionally, the memory-side interface 156 may include input/output (I/O) contact pad portions 160 in communication with the memory I/O circuitry 158. For example, the signals that the memory I/O circuitry 158 generates for transmission to the controller die 102 may be communicated from the output driver circuits of the memory I/O circuitry 158 to the I/O contact pads 160. Similarly, the signals that the memory-side interface 156 receives from the controller die 102 may be sent from the I/O contact pads 160 to input circuits (e.g., input buffer circuits) of the memory I/O circuitry 158. In addition, as described in further detail below, the I/O contact pads 160, along with wire bond elements (WBE) (shown in FIG. 3) may form or be part of the transmission lines 134 over which the memory dies 104 and the controller die 102 communicate signals between each other.

Added by DJM 12 2021