6573

Application Dedicated termination dies for memory systems
Matter Number FSP1845 Reference Case 1 FSP1845
Created 12/22/21, 12:00 AM Modified 12/22/21, 12:00 AM
Application Number

16/146,238

Paragraph Number

60

Content

In a two dimensional memory structure, the semiconductor memory elements are arranged in a single plane or a single memory device level. Typically, in a two dimensional memory structure, memory elements are arranged in a plane (e.g., in an x-z direction plane) which extends substantially parallel to a major surface of a substrate that supports the memory elements. The substrate may be a wafer over or in which the layer of the memory elements are formed or it may be a carrier substrate which is attached to the memory elements after they are formed. As a non-limiting example, the substrate may include a semiconductor such as silicon.

Notes

Added by DJM 12 2021