16/146,238

Paragraph Number

14

By way of introduction, the below embodiments relate to reducing effective die capacitance through elimination of on-die termination (ODT) resistance circuits from one or more dies of a die group, such as a die stack, which in turn, may allow for increased frequency, bandwidth, and/or data rates over transmission lines coupled to the die group. In one embodiment, an apparatus that includes a transmission line and a group of dies coupled to the transmission line. The group of dies includes: a first die configured with an on-die termination resistance circuit coupled to the transmission line; and a second die configured without any on-die termination resistance circuits coupled to the transmission line.

Added by DJM 12 2021