Paragraph 14
Paragraph 14
Application
Dedicated termination dies for memory systems
Matter Number
FSP1845
Paragraph Number
14
Application Number
16/146,238
Reference Case 1
FSP1845
Reference Case 2
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Created
12/22/21, 12:00 AM
Modified
12/22/21, 12:00 AM
Id
6,527
Content
By way of introduction, the below embodiments relate to reducing effective die capacitance through elimination of on-die termination (ODT) resistance circuits from one or more dies of a die group, such as a die stack, which in turn, may allow for increased frequency, bandwidth, and/or data rates over transmission lines coupled to the die group. In one embodiment, an apparatus that includes a transmission line and a group of dies coupled to the transmission line. The group of dies includes: a first die configured with an on-die termination resistance circuit coupled to the transmission line; and a second die configured without any on-die termination resistance circuits coupled to the transmission line.
Notes
Added by DJM 12 2021