16455676
Paragraph Number108
2572
| Application | Electrical Interconnection of Image Sensor package | ||
|---|---|---|---|
| Matter Number | ONSO3305US - Onsemi346 | Reference Case 1 | ONSO3305US - Onsemi346 |
| Created | 3/3/21, 12:00 AM | Modified | 3/3/21, 12:00 AM |
Application Number
Content
19.The method of claim 14, wherein each of the two or more die pads comprise a pad pitch of substantially 60 microns.
Notes
Added by DJM 3 2021