Paragraph 104

Paragraph 104

Application: ONSO3305US - Onsemi346

Matter Number ONSO3305US - Onsemi346
Paragraph Number 104
Application Number 16455676
Reference Case 1 ONSO3305US - Onsemi346
Reference Case 2
Created 3/3/21, 12:00 AM
Modified 3/3/21, 12:00 AM
Id 2,568
Content
15. The method of claim 14, wherein etching comprises angling one or more sidewalls of the semiconductor wafer.
Notes Added by DJM 3 2021