16455676
Paragraph Number96
2560
| Application | Electrical Interconnection of Image Sensor package | ||
|---|---|---|---|
| Matter Number | ONSO3305US - Onsemi346 | Reference Case 1 | ONSO3305US - Onsemi346 |
| Created | 3/3/21, 12:00 AM | Modified | 3/3/21, 12:00 AM |
Application Number
Content
coupling the second side of the semiconductor wafer to the first side of the optically transmissive substrate, wherein the two or more inner bumps are coupled on either side of the one or more scribe lines;
Notes
Added by DJM 3 2021