16455676
Paragraph Number94
2558
| Application | Electrical Interconnection of Image Sensor package | ||
|---|---|---|---|
| Matter Number | ONSO3305US - Onsemi346 | Reference Case 1 | ONSO3305US - Onsemi346 |
| Created | 3/3/21, 12:00 AM | Modified | 3/3/21, 12:00 AM |
Application Number
Content
providing a semiconductor wafer comprising a first side and a second side, wherein a plurality of active areas is comprised on the second side of the semiconductor wafer and two or more die pads are comprised around each of the plurality of active areas;
Notes
Added by DJM 3 2021