2554

Application Electrical Interconnection of Image Sensor package
Matter Number ONSO3305US - Onsemi346 Reference Case 1 ONSO3305US - Onsemi346
Created 3/3/21, 12:00 AM Modified 3/3/21, 12:00 AM
Application Number

16455676

Paragraph Number

90

Content

13.The semiconductor package of claim 5, wherein one or more sidewalls of the semiconductor die are angled between 85 degrees and 60 degrees from a plane formed by the first side of the semiconductor die.

Notes

Added by DJM 3 2021