Paragraph 87

Paragraph 87

Application: ONSO3305US - Onsemi346

Matter Number ONSO3305US - Onsemi346
Paragraph Number 87
Application Number 16455676
Reference Case 1 ONSO3305US - Onsemi346
Reference Case 2
Created 3/3/21, 12:00 AM
Modified 3/3/21, 12:00 AM
Id 2,551
Content
10.The semiconductor package of claim 7, wherein the two or more bumps are copper pillars comprising solder tips.
Notes Added by DJM 3 2021