Paragraph 77
Paragraph 77
Matter Number
ONSO3305US - Onsemi346
Paragraph Number
77
Application Number
16455676
Reference Case 1
ONSO3305US - Onsemi346
Reference Case 2
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Created
3/3/21, 12:00 AM
Modified
3/3/21, 12:00 AM
Id
2,541
Content
6.The semiconductor package of claim 1, wherein one or more side walls of the semiconductor die are angled between 85 degrees and 60 degrees from a plane formed by the first side of the semiconductor die.
Notes
Added by DJM 3 2021