16455676
Paragraph Number73
2537
| Application | Electrical Interconnection of Image Sensor package | ||
|---|---|---|---|
| Matter Number | ONSO3305US - Onsemi346 | Reference Case 1 | ONSO3305US - Onsemi346 |
| Created | 3/3/21, 12:00 AM | Modified | 3/3/21, 12:00 AM |
Application Number
Content
2.The semiconductor package of claim 1, wherein a pad pitch of the two or more bumps is substantially 60 microns.
Notes
Added by DJM 3 2021