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Application Electrical Interconnection of Image Sensor package

Matter Number ONSO3305US - Onsemi346

Paragraph Number 73

Application Number 16455676

Reference Case 1 ONSO3305US - Onsemi346

Reference Case 2 —

Created 3/3/21, 12:00 AM

Modified 3/3/21, 12:00 AM

Id 2,537

Content

2.The semiconductor package of claim 1, wherein a pad pitch of the two or more bumps is substantially 60 microns.

Notes Added by DJM 3 2021