Paragraph 55
Paragraph 55
Matter Number
ONSO3305US - Onsemi346
Paragraph Number
55
Application Number
16455676
Reference Case 1
ONSO3305US - Onsemi346
Reference Case 2
—
Created
3/3/21, 12:00 AM
Modified
3/3/21, 12:00 AM
Id
2,519
Content
In various implementations, the method may include forming dams on the optically transmissive substrate. Referring to FIG. 5, one or more dams 34 are illustrated after formation over a portion of the first RDLs 32. In various implementations, the dams may be formed of material including, by non-limiting example, liquid epoxy, silicone, or other encapsulants that may provide device protection, reduce warpage, demonstrate excellent flow, offer good adhesion to multiple substrates, and/or have the strength to handle over-molding and subsequent process steps. In some implementations, adhesive or other material may be formed over the first RDLs on the first side of the optically transmissive substrate 24.
Notes
Added by DJM 3 2021