16455676
Paragraph Number53
2517
| Application | Electrical Interconnection of Image Sensor package | ||
|---|---|---|---|
| Matter Number | ONSO3305US - Onsemi346 | Reference Case 1 | ONSO3305US - Onsemi346 |
| Created | 3/3/21, 12:00 AM | Modified | 3/3/21, 12:00 AM |
Application Number
Content
Referring to FIG. 3, a side view of an implementation of an optically transmissive substrate is illustrated. In various implementations, the optically transmissive substrate may include, by non-limiting example, glass, polycarbonate, acrylic, plastics, or other materials that allow some or all of a desired wavelength of light to pass through the material. The optically transmissive substrate has a first side 28 and a second side 26. The scribe lines 30 are illustrated on the first side of the optically transmissive substrate in FIG. 3. However, the scribe lines 30 may be visible from either the first side or the second side of the optically transmissive lid. The scribe lines 30 on the optically transmissive substrate may be thinner in methods of forming a semiconductor package having no TSVs as described herein in comparison to methods of forming semiconductor packages having TSVs. By non-limiting example, the scribe lines illustrated may have a thickness of less than 150 microns.
Notes
Added by DJM 3 2021