16455676
Paragraph Number46
2510
| Application | Electrical Interconnection of Image Sensor package | ||
|---|---|---|---|
| Matter Number | ONSO3305US - Onsemi346 | Reference Case 1 | ONSO3305US - Onsemi346 |
| Created | 3/3/21, 12:00 AM | Modified | 3/3/21, 12:00 AM |
Application Number
Content
FIG. 17 is a side view of an implementation of semiconductor die coupled to an implementation of an optically transmissive substrate after formation of bumps on the first side of the semiconductor die; and
Notes
Added by DJM 3 2021