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Paragraph 43

Application: ONSO3305US - Onsemi346

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Application Electrical Interconnection of Image Sensor package
Matter Number ONSO3305US - Onsemi346
Paragraph Number 43
Application Number 16455676
Reference Case 1 ONSO3305US - Onsemi346
Reference Case 2 —
Created 3/3/21, 12:00 AM
Modified 3/3/21, 12:00 AM
Id 2,507
Content
FIG. 14 is a side view of an implementation of semiconductor die coupled to an implementation of an optically transmissive substrate after formation of a second redistribution layer (RDL);
Notes Added by DJM 3 2021