2506

Application Electrical Interconnection of Image Sensor package
Matter Number ONSO3305US - Onsemi346 Reference Case 1 ONSO3305US - Onsemi346
Created 3/3/21, 12:00 AM Modified 3/3/21, 12:00 AM
Application Number

16455676

Paragraph Number

42

Content

FIG. 13 is a side view of an implementation of semiconductor die coupled to an implementation of an optically transmissive substrate after forming an isolation layer around the plurality of semiconductor die;

Notes

Added by DJM 3 2021