16455676
Paragraph Number40
2504
| Application | Electrical Interconnection of Image Sensor package | ||
|---|---|---|---|
| Matter Number | ONSO3305US - Onsemi346 | Reference Case 1 | ONSO3305US - Onsemi346 |
| Created | 3/3/21, 12:00 AM | Modified | 3/3/21, 12:00 AM |
Application Number
Content
FIG. 11 is a side view of an implementation of semiconductor die coupled to an implementation of an optically transmissive substrate after exposing one or more inner terminals of first RDL on the cover glass;
Notes
Added by DJM 3 2021