2504

Application Electrical Interconnection of Image Sensor package
Matter Number ONSO3305US - Onsemi346 Reference Case 1 ONSO3305US - Onsemi346
Created 3/3/21, 12:00 AM Modified 3/3/21, 12:00 AM
Application Number

16455676

Paragraph Number

40

Content

FIG. 11 is a side view of an implementation of semiconductor die coupled to an implementation of an optically transmissive substrate after exposing one or more inner terminals of first RDL on the cover glass;

Notes

Added by DJM 3 2021