16455676
Paragraph Number37
2501
| Application | Electrical Interconnection of Image Sensor package | ||
|---|---|---|---|
| Matter Number | ONSO3305US - Onsemi346 | Reference Case 1 | ONSO3305US - Onsemi346 |
| Created | 3/3/21, 12:00 AM | Modified | 3/3/21, 12:00 AM |
Application Number
Content
FIG. 8 is a close-up view of an implementation of an inner bump joint coupled between an implementation of an optically transmissive substrate and an implementation of a semiconductor wafer;
Notes
Added by DJM 3 2021