2499

Application Electrical Interconnection of Image Sensor package
Matter Number ONSO3305US - Onsemi346 Reference Case 1 ONSO3305US - Onsemi346
Created 3/3/21, 12:00 AM Modified 3/3/21, 12:00 AM
Application Number

16455676

Paragraph Number

35

Content

FIG. 6 is a side view of an implementation of a semiconductor wafer after bump formation;

Notes

Added by DJM 3 2021