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Application Electrical Interconnection of Image Sensor package

Matter Number ONSO3305US - Onsemi346

Paragraph Number 35

Application Number 16455676

Reference Case 1 ONSO3305US - Onsemi346

Reference Case 2 —

Created 3/3/21, 12:00 AM

Modified 3/3/21, 12:00 AM

Id 2,499

Content

FIG. 6 is a side view of an implementation of a semiconductor wafer after bump formation;

Notes Added by DJM 3 2021