Dave's PCF WIP: Paragraphs

Paragraph 28

Edit New Paragraph List Paragraphs Delete

Application Electrical Interconnection of Image Sensor package

Matter Number ONSO3305US - Onsemi346

Paragraph Number 28

Application Number 16455676

Reference Case 1 ONSO3305US - Onsemi346

Reference Case 2 —

Created 3/3/21, 12:00 AM

Modified 3/3/21, 12:00 AM

Id 2,492

Content

Each of the two or more die pads may have a pad pitch of substantially 70 microns.

Notes Added by DJM 3 2021