16455676
Paragraph Number27
2491
| Application | Electrical Interconnection of Image Sensor package | ||
|---|---|---|---|
| Matter Number | ONSO3305US - Onsemi346 | Reference Case 1 | ONSO3305US - Onsemi346 |
| Created | 3/3/21, 12:00 AM | Modified | 3/3/21, 12:00 AM |
Application Number
Content
Each of the two or more die pads may have a pad pitch of substantially 60 microns.
Notes
Added by DJM 3 2021