Paragraph 24
Paragraph 24
Matter Number
ONSO3305US - Onsemi346
Paragraph Number
24
Application Number
16455676
Reference Case 1
ONSO3305US - Onsemi346
Reference Case 2
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Created
3/3/21, 12:00 AM
Modified
3/3/21, 12:00 AM
Id
2,488
Content
The one or more sidewalls of the semiconductor die may be angled between 85 degrees and 60 degrees from a plane formed by the first side of the semiconductor die after etching.
Notes
Added by DJM 3 2021