16455676
Paragraph Number24
2488
| Application | Electrical Interconnection of Image Sensor package | ||
|---|---|---|---|
| Matter Number | ONSO3305US - Onsemi346 | Reference Case 1 | ONSO3305US - Onsemi346 |
| Created | 3/3/21, 12:00 AM | Modified | 3/3/21, 12:00 AM |
Application Number
Content
The one or more sidewalls of the semiconductor die may be angled between 85 degrees and 60 degrees from a plane formed by the first side of the semiconductor die after etching.
Notes
Added by DJM 3 2021