2484

Application Electrical Interconnection of Image Sensor package
Matter Number ONSO3305US - Onsemi346 Reference Case 1 ONSO3305US - Onsemi346
Created 3/3/21, 12:00 AM Modified 3/3/21, 12:00 AM
Application Number

16455676

Paragraph Number

20

Content

One or more sidewalls of the semiconductor die may be angled between 85 degrees and 60 degrees from a plane formed by the first side of the semiconductor die.

Notes

Added by DJM 3 2021