Paragraph 20
Paragraph 20
Matter Number
ONSO3305US - Onsemi346
Paragraph Number
20
Application Number
16455676
Reference Case 1
ONSO3305US - Onsemi346
Reference Case 2
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Created
3/3/21, 12:00 AM
Modified
3/3/21, 12:00 AM
Id
2,484
Content
One or more sidewalls of the semiconductor die may be angled between 85 degrees and 60 degrees from a plane formed by the first side of the semiconductor die.
Notes
Added by DJM 3 2021