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Paragraph Number

13

Implementations of semiconductor packages may include: a semiconductor die having a first side and a second side. The semiconductor package may also include an active area on the second side of the die and two or more bumps coupled to a second side of the die on either side of the active area. A first redistribution layer (RDL) may be coupled to each of the two or more bumps and may extend to an edge of the semiconductor die. An optically transmissive lid may be coupled to the semiconductor die through the two or more bumps and the first RDL. The semiconductor package may also include a second redistribution layer (RDL) coupled with the first RDL on the second side of the semiconductor die. The second RDL may extend to the first side of the semiconductor die.

Added by DJM 3 2021