Paragraph 6
Paragraph 6
Matter Number
ONSO3305US - Onsemi346
Paragraph Number
6
Application Number
16455676
Reference Case 1
ONSO3305US - Onsemi346
Reference Case 2
—
Created
3/3/21, 12:00 AM
Modified
3/3/21, 12:00 AM
Id
2,470
Content
Implementations of semiconductor packages may include: a semiconductor die having a first side and a second side and an active area on the second side of the die. The semiconductor packages may also include two or more bumps coupled to two or more die pads on a second side of the die. The semiconductor packages may include an optically transmissive lid coupled to the semiconductor die through an adhesive, two or more bumps, and a first redistribution layer (RDL). The semiconductor package may include a second redistribution layer (RDL) coupled with the first RDL on the second side of the semiconductor die. The second RDL may extend to the first side of the semiconductor die. The first RDL may extend to an edge of the semiconductor die.
Notes
Added by DJM 3 2021