16455676
Paragraph Number5
2469
| Application | Electrical Interconnection of Image Sensor package | ||
|---|---|---|---|
| Matter Number | ONSO3305US - Onsemi346 | Reference Case 1 | ONSO3305US - Onsemi346 |
| Created | 3/3/21, 12:00 AM | Modified | 3/3/21, 12:00 AM |
Application Number
Content
Semiconductor packages sometimes have through silicon vias (TSVs) to provide electrical interconnection between front side metal pads and backside outer terminals of an image sensor package. Formation of TSVs includes silicon and dielectric etch, isolation lithography, as well as temperature changes during the processing steps.
Notes
Added by DJM 3 2021