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The portion of the transmission line 308 that extends over the wire bond portion 320 may have an associated characteristic impedance dependent on inductance values of the wire bonds 320 and the die capacitance of the dies 304, 310 of the die group 306. FIG. 5 shows a circuit schematic diagram of the inductance L provided by the wire bonds 320 and the die capacitance C(M) of the dies 304 corresponding to the configuration of FIG. 3. In particular, a first inductor L.sub.320(1) indicates the inductance of the first wire bond 320(1), a second inductance L.sub.320(2) indicates the inductance of the second wire bond 320(2), a third inductance L.sub.320(3) indicates the inductance of the third wire bond 320(3), and an (N+1)th inductance L.sub.320(N+1) indicates the inductance of the (N+1)th wire bond 320(N+1). Additionally, a first capacitor C(M1) represents a die capacitance of the first memory die 304(1), a second capacitor C(M2) represents a die capacitance of the second memory die 304(2), and an (N+1)th capacitor C(M(N+1)) represents a die capacitance of the end die 310. As shown in FIG. 5, the inductors L.sub.320 are connected in series with each other, and the die capacitances C(M) are connected in shunt with respect to the inductors L.sub.320 and with reference to ground (GND). The associated characteristic impedance of the wire bonds 320 is dependent on or determined by the square root of the inductance L divided by the capacitance C.

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<w:p w14:paraId="31ED30C5" w14:textId="77777777" w:rsidR="00EE2B08" w:rsidRDefault="00EE2B08"><w:r><w:t>The portion of the transmission line 308 that extends over the wire bond portion 320 may have an associated characteristic impedance dependent on inductance values of the wire bonds 320 and the die capacitance of the dies 304, 310 of the die group 306. FIG. 5 shows a circuit schematic diagram of the inductance L provided by the wire bonds 320 and the die capacitance C(M) of the dies 304 corresponding to the configuration of FIG. 3. In particular, a first inductor L.sub.320(1) indicates the inductance of the first wire bond 320(1), a second inductance L.sub.320(2) indicates the inductance of the second wire bond 320(2), a third inductance L.sub.320(3) indicates the inductance of the third wire bond 320(3), and an (N+1)</w:t></w:r><w:proofErr w:type="spellStart"/><w:r><w:t>th</w:t></w:r><w:proofErr w:type="spellEnd"/><w:r><w:t xml:space="preserve"> inductance L.sub.320(N+1) indicates the inductance of the (N+1)</w:t></w:r><w:proofErr w:type="spellStart"/><w:r><w:t>th</w:t></w:r><w:proofErr w:type="spellEnd"/><w:r><w:t xml:space="preserve"> wire bond 320(N+1). Additionally, a first capacitor C(M1) represents a die capacitance of the first memory die 304(1), a second capacitor C(M2) represents a die capacitance of the second memory die 304(2), and an (N+1)</w:t></w:r><w:proofErr w:type="spellStart"/><w:r><w:t>th</w:t></w:r><w:proofErr w:type="spellEnd"/><w:r><w:t xml:space="preserve"> capacitor </w:t></w:r><w:r><w:lastRenderedPageBreak/><w:t xml:space="preserve">C(M(N+1)) represents a die capacitance of the end die 310. As shown in FIG. 5, the inductors L.sub.320 are connected in series with each other, and the die capacitances C(M) are connected in shunt with respect to the inductors L.sub.320 and with reference to ground (GND). The associated characteristic impedance of the wire bonds 320 is dependent on or determined by the square root of the inductance L divided by the capacitance C. </w:t></w:r></w:p>