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| Matter Number | US-20200098728-A1 | Application Id | 17 | ||||||
|---|---|---|---|---|---|---|---|---|---|
| Application Title | Semiconductor device with die-skipping wire bonds | Abstract | A semiconductor device is disclosed including a wire bonded die stack where the bond wires skip dies in the die stack to provide bond wires having a long length. In one example, the semiconductor dies are stacked on top of each other with offsets along two | ||||||
| Description | |||||||||
| Pub Number | US-20200098728-A1 | Application Number | 16143102 | Patent Number | |||||
| Application Category | Attorney Matter Number | Url | https://patents.google.com/patent/US20200098728A1/en | Url Pdf | https://patentimages.storage.googleapis.com/c1/60/8a/6f0424e1ed5472/US20200098728A1.pdf | ||||
| Authored By | Vierra | May Reuse | 0 | Filing Date | Created | Modified | 3/16/21, 7:26 PM |