Matter US-20200098728-A1
Semiconductor device with die-skipping wire bonds
Matter Number
US-20200098728-A1
Application Id
17
May Reuse
0
Application Title
Semiconductor device with die-skipping wire bonds
Pub Number
US-20200098728-A1
Application Number
16143102
Patent Number
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Application Category
—
Attorney Matter Number
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Authored By
Vierra
Filing Date
—
Created
—
Modified
3/16/21, 7:26 PM
Assignee
Western Digital Technologies Inc
Abstract
A semiconductor device is disclosed including a wire bonded die stack where the bond wires skip dies in the die stack to provide bond wires having a long length. In one example, the semiconductor dies are stacked on top of each other with offsets along two
Description
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