| Matter Number | US-20200098728-A1 | Application Id | 17 |
|---|---|---|---|
| Application Title | Semiconductor device with die-skipping wire bonds | Abstract | A semiconductor device is disclosed including a wire bonded die stack where the bond wires skip dies in the die stack to provide bond wires having a long length. In one example, the semiconductor dies are stacked on top of each other with offsets along two |
| Description | |||
| Pub Number | US-20200098728-A1 | Application Number | 16143102 |
| Patent Number | Application Category | ||
| Attorney Matter Number | Authored By | Vierra | |
| Source URL | Open URL | Source PDF | Open PDF |
| May Reuse | 0 | Filing Date | |
| Created | Modified | 3/16/21, 7:26 PM | |